Valens Semiconductor to Present its Award-Winning High-Performance Connectivity Solutions at CES 2024
January 9, 2024
Valens Semiconductor will showcase in-vehicle connectivity innovations for the automotive market, including a head-to-head EMC shootout against the competition; the company will also display its new award-winning USB3.2 extension for the videoconferencing, industrial and medical imaging markets
HOD HASHARON, Israel, January 8, 2024 – Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, today announced that it will showcase how its MIPI A-PHY compliant VA7000 chipset series outperforms industry benchmarks in a variety of parameters, opening the door for innovations in ADAS and autonomous driving. The company will display live demonstrations of the high-performance connectivity solution that will spotlight key benefits of the chipset series, including:
- Resilient & flawless EMC performance – A head-to-head EMC shootout against a competing proprietary solution, highlighting the pressing issue of EMC as OEMs integrate systems that require higher bandwidth than ever before.
- The longest reach in automotive – Extension of an 8MP camera for 40 meters over Coax cabling, far surpassing the current industry benchmark of only 15 meters and demonstrating the flexibility, scalability, and EMC robustness of A-PHY.
- Low-level sensor fusion – Featuring the centralized processing of raw data from cameras, radars, and LiDARs for unparalleled perception, enabled by A-PHY’s advanced time synchronization and fast Serial Peripheral Interface (SPI) control capabilities.
- The vast MIPI A-PHY ecosystem – An extensive exhibit of more than twenty MIPI A-PHY-compliant products from leading automotive Tier 1s and Tier 2s.
Valens Semiconductor will also feature its VS6320 chipset, the first-to-market single-chip solution for professional-grade extension of USB3.2, recognized as a CES® 2024 Innovation Awards Honoree in the Embedded Technologies category for outstanding design and engineering. The VS6320 is a high-performance and efficient long-distance single-chip USB3.2 extension solution for up to 100 meters/328 feet, addressing a critical need in the global videoconferencing, information technology (IT), industrial and medical markets.
Valens Semiconductor’s high-performance connectivity technology will be showcased at LVCC West Hall #W317.
“We’ve been telling the industry that our chips are the most resilient on the market, but for the first time, at CES 2024, everyone will be able to see the comparison for themselves,” said Gideon Ben Zvi, CEO of Valens Semiconductor. “We’re thrilled to see that the automotive ecosystem is moving past proprietary analog-based technology to MIPI’s digital standard of the future. I, and the rest of the Valens Semiconductor team, look forward to welcoming visitors to our booth to learn about our latest innovative solutions.”
Select quotes from our MIPI A-PHY partners whose products will be on display at the Valens Semiconductor booth:
Kenji Onishi, Deputy Senior General Manager, Automotive Business Division, Sony Semiconductor Solutions Corporation: “Demand for image sensors that propel connectivity and support the development of more advanced automotive camera systems is on the rise. Furthermore, interoperability between multiple vendor offerings is necessary for the success of any standard. As market leaders, it is highly important for Sony Semiconductor Solutions to introduce cutting-edge technology into our image sensors, and MIPI A-PHY serializer integration delivers significant cost and performance benefits for our automotive customers.”
Sam Qin, Vice General Manager at Shanghai G-Pulse Electronics Technology, a wholly owned subsidiary of Intron Technology Holdings: “At G-Pulse, our mission is to foster the development of the automotive industry in China with cutting-edge offerings. We are highly impressed by Valens Semiconductor’s VA7000 MIPI A-PHY compliant chipsets, which address the increasing requirements for safer and automated driving. Specifically, Valens Semiconductor’s high-performance connectivity solution will boost a new paradigm of radar and camera sensor fusion.”
Bill Pu, Co-Founder and President of Leopard Imaging: “We recently partnered with leading sensor vendors on MIPI A-PHY camera modules, as they were impressed by the unprecedented reach, flawless EMC immunity and noise tolerance provided. These benefits coupled with high bandwidth, are poised to open the door for new applications and industries. We are already seeing interest from our partners for A-PHY, and we expect long-term demand to build up for machine vision-based industries.”
Katsunori Nogami, Senior Executive Officer and CTO at Nippon Chemi-Con: “Nippon Chemi-Con foresees growing demand for the MIPI A-PHY standard as the foundation for robust high-resolution ADAS systems. That is why we realized the great importance in embedding Valens’ VA7000’s A-PHY compliant chipsets in our new camera modules, towards adoption by our leading automotive customers.”
Please join Valens Semiconductor at CES 2024 (LVCC, West Hall, #W317, January 9 –12, 2024) to learn more about our latest innovations. Contact us here to schedule a meeting.
About Valens Semiconductor
Valens Semiconductor is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens’ chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
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