Circuit Team Leader

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Job Description

Lead the circuit design activities, pre and post silicon, in mixed signal full chips.

Technical responsibilities:

  • Custom design of high speed circuits.
  • IO ring structure.
  • Floor plan and bump map / pad allocation.
  • Power budgeting and analysis.
  • IR drop and EM.
  • Package selection and ball map definition.
  • Define and / or select mixed signal IPs and high speed serdes.
  • Guarantee proper integration of mixed signal IPs and high speed serdes in all levels – die, package, board and final test.
  • Spice and mixed mode simulations.
  • Process parameters analysis and technical communication with various FABs.

Management responsibilities:

  • Define the tasks and timelines for the circuit team’s activity in a project.
  • Guarantee quality and schedule of the team’s deliverables in a project.
  • Manage the activity of external circuit and backend vendors or contractors.
  • Manage the activity of package substrate implementation with external vendors and in collaboration with other departments in Valens.
  • Manage the technical communication with the FAB and lead the various tapeout activities.

Job Requirements

  • University graduate with a degree of B.Sc or higher in electrical engineering.
  • 10+ years of experience in circuit or mixed signal design.
  • 5+ years of experience in leading circuit or mixed signal teams.
  • Good acquaintance with Virtuoso IC61 custom design, layout and simulation environment.
  • Good acquaintance with various aspects and considerations of mixed signal full chip design flow from netlist to GDS: Floor plan, IO ring implementation ,IR drop and EM, bump map, PnR & timing considerations, power analysis , IR & EM prevention and analysis , Full chip integration of mixed signal circuits and high speed serdes.
  • Good social and verbal skills. Capable of working in a multi discipline environment and managing mutli site teams while meeting tight schedules.
  • Fluent English.


  • Experience in low power circuit design and power switching flow.
  • Experience in post silicon testing and characterization.
  • Experience in design, layout and simulation of circuits in 28nm and below
  • Experience in configuring and running backend verification tools –DRC,LVS, Extraction, PERC.
  • Experience in design for automotive applications (infotainment or ADAS).
  • Acquaintance with figures of merit for high speed serdes and mixed signal circuits.
  • Acquaintance with standards of high speed interfaces: HDMI2.0 , HDMI1.4 , USB2_0 , USB3_0 , SGMII , RGMII , MIPI CSI-2 , Display port , PCIE.





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